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By Pepin Press

STRUCTURAL package deal layout is a chain of books, packed with excellent, a hundred% structurally actual, scalable packaging templates. All designs are prepared for fast use and illustrated with 2-D and 3-D structural drawings and images. The CD includes the templates in a variety of codecs together with EPS and PDF. additionally integrated is a demos model of Illustrator?-Plug-Ins that supply expert package deal layout chances. This quantity ? complex PACKAGING ? includes two hundred extra advanced designs.

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Balancing these modifications is the requirement for finer control on fillet length and height, as flip chip interconnects move into the realm of chip-scale packaging. The engineering design of surface tension and wetting characteristics of underfill materials has come into an increased role in the formulation of this class of materials. Lead-free bump materials with different surface characteristics and more rigid bumps are being implemented, at the same time lower-k dielectrics are becoming increasingly fragile.

Chip-scale packaging originally was conceived to be an underfill-free technology, with the objective of eliminating these costs. In practice, however, many assemblers still prefer to use some kind of countermeasure against the effects of CTE mismatch. Data from experimental lead-free chip-scale packages indicates that this is a wise move — the reliability of lead-free solder joints appears lower than for lead-rich joints in packages where global strains are high. Factors that increase global strain include low stand-off height relative to overall package dimensions, direct attachment to the substrate by solder balls, and large in-use temperature changes.

Factors that increase global strain include low stand-off height relative to overall package dimensions, direct attachment to the substrate by solder balls, and large in-use temperature changes. Rapidly shrinking interconnect pitches, increasing circuit board density, and rising penetration of electronics into increasingly harsh automotive, telecom, aerospace, and other environments means that manufacturers must quickly identify suitable CSP underfill materials and processes for lead-free assembly.

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Advanced Packaging by Pepin Press


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